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Turnkey PCB Assembly Service with SMT DIP and Component Sourcing

Turnkey PCB assembly service with PCB fabrication, component sourcing, SMT and DIP assembly, AOI, X-Ray, ICT, FCT and box build from prototype to mass production.
TECHNICAL SPECIFICATION
Category
PCBA
Packaging
Standard Package
MOQ
Negotiable
APPLICATIONS
Consumer Electronics, Industrial Control Equipment, Automotive Electronics, Medical Devices, IoT Products, Communication Modules, LED Lighting, Power Supplies, Security Equipment

Product Details

Turnkey PCB Assembly Service

Turnkey PCB assembly service covering PCB fabrication, component sourcing, SMT assembly, DIP or through-hole assembly, inspection, testing and final box build.

Customers can provide Gerber files and BOM data while the complete manufacturing process is handled through one production workflow, from engineering prototypes and small batches to mass production.

Complete Turnkey PCBA Process

The turnkey service covers the complete PCB assembly process.

Component procurement and kitting are followed by PCB fabrication, solder paste printing, SMT placement, reflow soldering, AOI inspection, DIP assembly, functional testing and final quality control.

The finished boards can be supplied as tested PCB assemblies or as completed products with box-build assembly.

PCB Fabrication

PCB fabrication is available for 1 to 32 layer boards using FR4, High-Tg FR4, aluminum and Rogers materials.

Board thickness from 0.6mm to 3.2mm is supported on this service page, with PCB construction selected according to the electrical, thermal and mechanical requirements of the project.

SMT PCB Assembly

The SMT assembly process supports fine-pitch and small-size components, including 0201 components, QFN, QFP and BGA packages.

High-speed placement equipment is used for production, with precision placement capability down to ±0.02mm.

Both single-sided and double-sided assembly can be supported.

DIP and Through-Hole Assembly

Through-hole components can be assembled together with SMT devices for mixed-technology PCBAs.

DIP assembly is suitable for connectors, terminals, transformers, large capacitors, switches and other components that require through-hole mounting.

BGA and Fine-Pitch Assembly

BGA, QFN and other fine-pitch packages can be included in turnkey PCBA projects.

X-Ray inspection is available for hidden solder joints and BGA connections where visual inspection is not sufficient.

Component Sourcing and Procurement

Component sourcing is included as part of the turnkey service.

The procurement team can source standard and hard-to-find components, handle kitting and provide component traceability for production projects.

Alternative components can also be evaluated when original parts have long lead times or availability issues.

PCB Assembly Inspection

Quality inspection can include SPI, AOI, X-Ray and flying probe testing.

SPI can be used to inspect solder paste printing, while AOI checks component placement and soldering conditions. X-Ray inspection is available for BGA and other hidden solder joints.

Functional and Reliability Testing

Testing can be configured according to the requirements of the electronic product.

Available testing includes ICT, FCT, burn-in and boundary scan. Functional testing can be used to verify the assembled board under actual or simulated operating conditions.

Conformal Coating and Potting

Additional protection can be added for PCBAs used in demanding environments.

Conformal coating and potting options can help protect electronic assemblies against moisture, dust and environmental exposure.

The coating material and process can be selected according to the application.

Box Build and Final Assembly

The turnkey service can extend beyond PCB assembly to final product integration.

Box-build services can include PCB installation, wiring, cable assembly, mechanical assembly and final product testing according to the project requirements.

This allows customers to receive a finished electronic assembly rather than only a bare PCBA.

Prototype and Small-Batch PCBA

The service supports engineering prototypes and small-batch production before volume manufacturing.

Prototype PCBA lead time is listed as 3–5 days, while production is typically 2–3 weeks depending on component availability.

There is no MOQ for prototypes, with flexible production quantities available for different project stages.

Mass Production

After prototype validation, the same manufacturing process can be transferred to small-batch and mass production.

Component sourcing, PCB fabrication, SMT/DIP assembly, inspection and testing can remain within the same production workflow to maintain consistency between prototype and production boards.

OEM and ODM PCB Assembly

The turnkey PCBA service supports OEM and ODM electronics manufacturing.

Customers can provide Gerber files, BOM data and assembly requirements. Engineering support can assist with DFM review, component selection, assembly process planning and production testing.

Turnkey PCBA Applications

Consumer Electronics

PCB assembly for consumer electronic products, control boards, smart devices and connected products.

Industrial Control Equipment

PCBA manufacturing for industrial controllers, automation equipment and machine control systems.

Automotive Electronics

Electronic assemblies for automotive modules and vehicle-related electronic systems.

Medical Devices

PCB assembly for medical and laboratory equipment requiring controlled production and testing.

IoT and Smart Home Products

Compact PCB assemblies for IoT devices, smart home controllers, sensors and connected equipment.

Communication Modules

PCBA manufacturing for communication equipment, networking devices and electronic modules.

LED Lighting and Power Supplies

Assembly services for LED control boards, power supply boards and related power electronics.

Security and Surveillance Systems

PCB assembly for security equipment, surveillance products and access-control electronics.

Technical Specifications

  • Service Type: Turnkey PCBA / Consignment Assembly

  • PCB Layers: 1–32 layers

  • PCB Materials: FR4, High-Tg FR4, Aluminum, Rogers

  • PCB Thickness: 0.6–3.2mm

  • Assembly Technology: SMT, DIP, Through-Hole, Mixed Assembly

  • Minimum Component Size: 01005

  • Placement Precision: ±0.02mm

  • Component Packages: 0201+, BGA, QFN, QFP, Through-Hole, Press-Fit

  • Assembly Sides: Single / Double Side

  • Inspection: SPI, AOI, X-Ray, Flying Probe

  • Testing: ICT, FCT, Burn-In, Boundary Scan

  • Additional Services: Conformal Coating, Potting, Box Build

  • Quality Standard: ISO9001:2015, IPC-A-610 Class 2/3

  • Environmental Compliance: RoHS

  • Production: Prototype, Small Batch and Mass Production

  • Prototype Lead Time: 3–5 days

  • Production Lead Time: 2–3 weeks

  • Prototype MOQ: No MOQ

Custom Turnkey PCB Assembly Manufacturing

The turnkey PCBA service provides a complete manufacturing route from PCB fabrication and component procurement to SMT/DIP assembly, testing and final product assembly.

Customers can use the service for prototypes, small-batch orders and mass production, with component sourcing, PCB manufacturing, assembly and testing handled within one integrated PCBA workflow.


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