Full Turnkey PCB Assembly Service with Fast Turnaround

Full Turnkey PCB Assembly Service

Full turnkey PCB assembly service covering component sourcing, PCB fabrication, SMT and DIP assembly, inspection and functional testing.

Customers can provide Gerber files, BOM and pick-and-place data while the complete manufacturing process is managed from PCB fabrication through finished and tested PCBA.

Complete Turnkey PCB Assembly

The turnkey manufacturing process covers the major stages of PCBA production through a single supplier.

Component sourcing, PCB fabrication, SMT placement, through-hole assembly, soldering, inspection and functional testing can all be handled as part of the same production workflow.

This reduces the need to coordinate separate PCB, component and assembly suppliers.

Component Sourcing

The service includes global electronic component sourcing for turnkey projects.

Original components can be sourced according to the BOM, with alternative components evaluated for long-lead, obsolete or unavailable parts.

Component procurement and production planning are coordinated with the assembly schedule.

PCB Fabrication

PCB fabrication supports 1 to 20 layer boards using FR4, aluminum and high-frequency PCB materials.

The PCB construction can be selected according to the electrical, thermal and mechanical requirements of the finished product.

Precision SMT Assembly

The SMT process supports components from 01005 packages through BGA, QFN and QFP devices.

Placement precision is specified at ±0.02mm, supporting high-density and fine-pitch PCB assembly.

Both standard SMT and mixed-technology assemblies can be produced according to the board design.

DIP and Through-Hole Assembly

Through-hole components can be assembled together with SMT components for mixed-technology PCBAs.

Wave soldering and selective soldering are available for connectors, terminals, transformers and other through-hole components.

BGA and Fine-Pitch Assembly

BGA, QFN and QFP packages can be assembled for compact and high-density electronic products.

X-Ray inspection is available for BGA solder joints and other hidden connections, while AOI provides additional inspection of component placement and soldering.

PCB Assembly Inspection

The manufacturing process includes multiple inspection stages.

AOI and X-Ray inspection are used after soldering, while ICT and FCT can be used to verify electrical and functional performance before shipment.

Production batches can be maintained with process traceability.

Functional Testing

Functional testing can be customized according to the customer's product requirements.

Test fixtures and procedures can be developed for specific PCBAs to verify power, communication, control and other product functions.

Fast Prototype Assembly

Prototype PCB assembly is available without a minimum order quantity.

The listed prototype turnaround is approximately 3–5 working days, depending on component availability and board complexity.

This makes the service suitable for engineering validation and early-stage product development.

Mass Production

After prototype validation, the same production process can be scaled to volume manufacturing.

The listed mass-production lead time is approximately 7–15 working days, subject to component availability, PCB complexity and order quantity.

Turnkey, Partial Turnkey and Consignment

The service supports three sourcing models.

Full turnkey assembly means the manufacturer handles component procurement and PCB assembly. Partial turnkey projects can use a combination of customer-supplied and manufacturer-sourced components.

Consignment or kitted assembly is also available when the customer supplies the required components.

Quality Control

Production follows IPC-A-610 Class II/III requirements, with ISO9001 and RoHS-compliant manufacturing processes.

AOI, X-Ray, ICT and FCT are used according to the product and testing requirements.

OEM and ODM PCB Assembly

OEM and ODM manufacturing is available for custom electronic products.

Customers can provide Gerber files, BOM, pick-and-place files and assembly notes. Engineering review can be carried out before PCB fabrication and component procurement.

Turnkey PCBA Applications

Industrial Electronics

PCB assemblies for industrial controllers, automation equipment, instrumentation and factory electronics.

Medical Electronics

PCBA manufacturing for medical equipment, laboratory devices and electronic control systems.

Automotive Electronics

Turnkey PCB assembly for automotive modules and vehicle-related electronic equipment.

Consumer Electronics

Assembly services for consumer devices, smart products and electronic control boards.

IoT Devices

Compact PCB assemblies for connected devices, sensors, gateways and smart systems.

Communication Equipment

PCBA manufacturing for communication modules, networking equipment and electronic communication products.

Power Electronics

PCB assembly for power supplies, control boards and power management equipment.

Smart Electronic Products

Turnkey manufacturing for smart devices requiring PCB fabrication, component sourcing, assembly and testing.

Technical Specifications

• Service Type: Full Turnkey / Partial Turnkey / Consignment

• PCB Layers: 1–20 layers

• PCB Materials: FR4, Aluminum, High-Frequency

• Assembly Technology: SMT, Through-Hole, Mixed Assembly

• Minimum Component Size: 01005

• Placement Precision: ±0.02mm

• Component Packages: BGA, QFN, QFP, 01005 and larger

• DIP Process: Wave Soldering / Selective Soldering

• Component Sourcing: Global Procurement / Original Components

• Inspection: AOI, X-Ray

• Testing: ICT, FCT, Functional Testing

• Quality Standard: IPC-A-610 Class II/III

• Quality System: ISO9001

• Environmental Compliance: RoHS

• Prototype MOQ: No MOQ

• Prototype Lead Time: 3–5 working days

• Mass Production Lead Time: 7–15 working days

• Shipping: DHL / FedEx / UPS

• Production: Prototype, Small Batch and Mass Production

Custom Full Turnkey PCBA Manufacturing

The full turnkey PCB assembly service combines PCB fabrication, component sourcing, SMT and DIP assembly, inspection and functional testing in one manufacturing process.

Customers can start with prototype quantities and scale the same PCBA design into small-batch and mass production, with sourcing and manufacturing managed through one integrated workflow.