High Frequency Communication PCB for RF 5G and Microwave Applications

High Frequency Communication PCB

This high frequency communication PCB is designed for RF, microwave, 5G and other communication applications where controlled electrical performance and stable signal transmission are important.

MCPCBA supports high-frequency PCB fabrication using Rogers, PTFE, Taconic and hybrid materials, together with RF PCBA assembly, component sourcing and testing. The service is suitable for both prototype development and production requirements.

Rogers and PTFE High Frequency Materials

The PCB can be manufactured with Rogers RO4000 and RO3000 series materials, RT5880, PTFE, Taconic and hybrid FR-4 constructions.

The listed dielectric constant range is Dk 2.2-10.2, with a dissipation factor range of 0.0009-0.004, depending on the selected material. These material options allow the board construction to be matched to different RF and microwave circuit requirements.

Controlled Impedance for RF Circuits

Controlled impedance is important for RF transmission lines and high-frequency communication circuits. The manufacturing service supports 50Ω and 100Ω transmission lines with impedance tolerance of ±5% to ±10%.

TDR testing can be used to verify impedance performance during production.

High Frequency PCB Manufacturing

The PCB manufacturing capability supports 1 to 20 layers for hybrid multilayer boards, with a frequency range listed up to 60 GHz for RF and microwave applications.

Available copper thickness ranges from 0.5oz to 3oz. Surface finishes include ENIG, ENEPIG, immersion silver and gold plating.

Quick-Turn RF PCB Prototyping

Prototype PCB proofing is available with a listed lead time of 3-7 working days. Engineering DFM feedback can also be provided during the prototype stage to identify manufacturing issues before production.

This is useful for RF and communication equipment developers who need to verify a PCB design before moving to a larger production run.

RF PCBA Assembly

The service can continue from bare PCB fabrication to complete PCBA manufacturing. SMT, DIP and RF component soldering are supported, followed by testing according to project requirements.

Component sourcing can also be included, allowing the PCB and assembly process to be handled through one manufacturing supplier.

Hybrid High Frequency PCB

Hybrid multilayer construction can combine high-frequency laminates with FR-4. This approach can be used when different parts of a board have different electrical and cost requirements.

High-frequency materials can be applied to RF sections while FR-4 is used for other circuit areas where standard PCB materials are suitable.

High Frequency PCB Applications

5G Base Stations and Communication Modules

RF and high-frequency boards for 5G base stations, communication modules and related networking equipment.

RF Front-End and Antenna Systems

PCB solutions for RF front-end circuits, antenna systems and wireless communication equipment.

Radar and Satellite Communication

High-frequency circuit boards for radar systems, satellite communication equipment and microwave transmission applications.

Microwave Sensors and IoT Devices

RF PCBs for microwave sensors, wireless IoT equipment and compact communication devices.

Automotive Radar and ADAS

High-frequency boards for automotive radar and advanced driver assistance systems.

Test and Measurement Equipment

RF and microwave PCBs for electronic test instruments and measurement equipment.

Technical Specifications

• PCB Type: High Frequency PCB, RF/Microwave PCB

• Base Materials: Rogers RO4003C, RO4350B, RT5880, PTFE, Taconic, Hybrid FR-4

• Dielectric Constant: Dk 2.2-10.2

• Dissipation Factor: Df 0.0009-0.004

• Layer Count: 1-20 layers

• Frequency: Up to 60 GHz

• Minimum Line/Space: 3.5mil/3.5mil

• Impedance Tolerance: ±5% to ±10%

• Impedance Testing: TDR

• Copper Thickness: 0.5oz-3oz

• PCB Thickness: 0.2mm-3.2mm

• Minimum Hole: 0.1mm mechanical hole

• Microvia: Laser microvia available

• Surface Finish: ENIG, ENEPIG, Immersion Silver, Gold Plating

• Assembly: SMT, DIP, RF Component Soldering

• Prototype Lead Time: 3-7 working days

Custom RF PCB and PCBA Manufacturing

Customers can provide PCB design files and project requirements for high-frequency PCB prototyping and production. The manufacturing process can include material selection, PCB fabrication, impedance control, RF component assembly and testing.

The service supports projects from initial PCB proofing through PCBA production, making it suitable for communication equipment developers, RF product manufacturers and electronic engineering teams.