FR4 Multilayer PCB & HDI PCBA Assembly and Design

FR4 Multilayer PCB and HDI PCBA

Merrillchip provides custom FR4 multilayer PCB and HDI PCBA manufacturing for electronic products that require compact board structures, high-density component placement and reliable electrical performance.

The service combines PCB design, multilayer PCB fabrication, HDI manufacturing, SMT assembly and testing. Customers can provide Gerber files, PCB design data and BOM information for prototype or production projects.

Key Features

• Custom FR4 multilayer PCB manufacturing

• HDI PCB fabrication

• HDI PCBA assembly

• PCB design and engineering support

• SMT and mixed-technology assembly

• Fine-pitch component assembly

• BOM component sourcing

• Prototype and small-batch production

• Functional testing and inspection

• OEM and ODM manufacturing

FR4 Multilayer PCB

FR4 multilayer PCBs are suitable for electronic products that require multiple signal and power layers within a compact board structure.

Multiple copper layers allow signal routing, power distribution and ground planes to be arranged more efficiently than on a conventional single- or double-sided PCB.

The board structure can be customized according to the circuit design, component density, electrical requirements and mechanical dimensions of the final product.

HDI PCB Manufacturing

HDI technology is designed for high-density electronic designs where conventional PCB routing may not provide sufficient space.

Microvias and fine routing structures allow more interconnections to be placed within a smaller PCB area. This makes HDI suitable for compact products with dense component layouts and limited board space.

PCB Design and Engineering

PCB design support can be provided for new product development and existing board optimization.

Engineering review can cover PCB stack-up, component placement, routing, manufacturability and assembly requirements before production.

Customers with completed designs can provide Gerber files and BOM data for manufacturing review.

SMT PCBA Assembly

The PCBA manufacturing process supports SMT assembly for compact electronic components and high-density circuit boards.

Assembly can be matched to the PCB design and component requirements. Through-hole components can also be integrated when required by the product design.

Component Sourcing

Component sourcing can be included in the PCBA manufacturing process.

Customers can provide an approved BOM, while components can be sourced according to the specified part numbers and production requirements. Alternative components can be evaluated when supply or availability issues occur, subject to customer approval.

Inspection and Testing

PCB assemblies can be inspected and tested according to the requirements of the product.

Typical production inspection can include AOI, visual inspection and electrical or functional testing. Additional inspection methods can be selected for complex or high-density assemblies.

Prototype to Production

The service supports prototype development, small-batch production and volume manufacturing.

Prototype PCBs and PCBAs can be used for design verification before the project moves into regular production. The manufacturing process can then be scaled according to the customer's production requirements.

Applications

Industrial Electronics

FR4 multilayer and HDI PCBAs can be used in industrial controllers, automation equipment, monitoring systems and other industrial electronic products.

Communication Equipment

High-density PCB structures are suitable for communication equipment and networking products where multiple signal paths need to be integrated into a compact board.

Medical Electronics

Custom multilayer PCBAs can be used in medical and healthcare electronics requiring compact circuit layouts and controlled manufacturing processes.

Automotive Electronics

HDI and multilayer PCB technology can be applied to automotive electronic control systems, interfaces and other space-constrained applications.

Consumer Electronics

Compact consumer electronic products can use HDI PCB structures to accommodate higher component density while reducing board size.

IoT Devices

HDI and multilayer PCBA manufacturing is suitable for IoT products that combine processors, wireless modules, sensors and other functions within a limited enclosure.

Custom FR4 and HDI PCBA Manufacturing

Merrillchip supports custom FR4 multilayer PCB and HDI PCBA projects from PCB design and fabrication through SMT assembly and testing.

The service is suitable for OEM and ODM customers that need a manufacturing partner for high-density electronic boards, from initial prototype development to production.