NEPCON ASIA 2026 has officially opened booth bookings as the electronics manufacturing exhibition expands its footprint to 90,000 sqm at the Shenzhen World Exhibition & Convention Center in Bao’an, China.
Scheduled for October 27-29, 2026, the event aims to strengthen collaboration across the electronics manufacturing supply chain, covering semiconductor components, intelligent assembly technologies, and embodied intelligence applications. Organizers said the exhibition will connect upstream and downstream ecosystem players while targeting new business opportunities across Asia and Europe.
The show will bring together buyers and suppliers from sectors including automotive electronics, industrial automation, consumer devices, smart homes, AI hardware, wearables, low-altitude flight systems, and embodied intelligence technologies.
A major focus of NEPCON ASIA 2026 will be three high-growth sectors: AI, automotive electronics, and semiconductors.
For AI-related manufacturing, the exhibition is expected to attract more than 1,000 companies across the AI hardware ecosystem, including terminal device manufacturers, EMS providers, OEMs, and component suppliers. Organizers expect participation from more than 9,000 buyers involved in AI hardware and intelligent terminal development and production.
In automotive electronics, the event will host the Symposium on Advanced Manufacturing Standards and Electronic Circuit Process Innovation for Automotive Electronics. The symposium will focus on automotive-grade PCBA manufacturing, process reliability, and compliance with standards including IATF 16949, AEC-Q, and ISO 26262. More than 13,000 automotive electronics professionals are expected to participate.
The semiconductor segment will feature a live demonstration line for semiconductor packaging and testing processes, including optical module and device packaging equipment. More than 50 material and equipment brands are expected to provide on-site demonstrations. The concurrent 9th Semiconductor Technology and Innovation Conference Forum will focus on IC packaging and advanced packaging technologies for optical communication modules.
Organizers said the semiconductor program is designed to connect exhibitors with more than 200 OSAT and IDM companies in South China, targeting engineering, manufacturing, and R&D decision-makers.
NEPCON ASIA 2026 will also emphasize emerging manufacturing opportunities in South China, including high-density circuit boards, photovoltaic energy storage equipment, semiconductor displays, and intelligent terminals. Additional outreach efforts will target emerging product categories such as AI headsets, smart glasses, electric mobility systems, and smart home platforms.
To strengthen international participation, the exhibition will focus on buyers from China, South Korea, Japan, Malaysia, Thailand, Vietnam, and Eastern European markets including Hungary, Poland, the Czech Republic, Slovakia, and Romania. Organizers aim to attract 3,000 international buyers through partnerships with overseas industry associations, chambers of commerce, and media organizations.
Supporting programs will include international business receptions, factory tours, and one-on-one matchmaking sessions intended to facilitate cross-border business cooperation.
Running alongside the exhibition will be ROBOTECH ASIA, focused on embodied intelligence robotics applications and supply chains. Companies including LEJU Robot and ROKAE Robot are expected to showcase robotics technologies targeting automotive and electronics manufacturing applications.
The embodied intelligence program will highlight industrial automation and robotic deployment in automotive, electronics, and logistics production environments. Organizers said the event will focus on intelligent manufacturing upgrades and labor replacement solutions for large-scale automated production lines.
NEPCON ASIA 2026 will also be integrated with the ITWA Asia exhibition network, covering a combined 180,000 sqm and expected to attract more than 170,000 professional visitors across electronics manufacturing, machine vision, intelligent vehicles, smart factories, advanced materials, AI, and AR-enabled systems.
Entegris and JSR/Inpria Ink Cross-Licensing Agreement on EUV Lithography
Stay updated with the latest industry trends and insights.
NEPCON ASIA 2026 has officially opened booth bookings as the electronics manufacturing exhibition expands its footprint to 90,000 sqm at the Shenzhen World Exhi...
Entegris Inc. and JSR Corp., the parent company of Inpria Corp., have entered into a non-exclusive cross-licensing agreement aimed at helping the semiconductor ...
Altera Corp. is collaborating with the Defense Innovation Unit (DIU) to develop a highly reconfigurable coherent Free Space Optics (FSO) modem prototype for the...
Advanced Semiconductor Engineering Inc. (ASE), a member of ASE Technology Holding Co. Ltd and a leading provider of semiconductor assembly and test services, ha...
Indonesia smartphone shipments declined by 9% year-on-year (YoY) in the first quarter (1Q 2026) as higher smartphone prices, stemming from the memory supply cri...
The Glass Core Substrate Market and Development Trends Report, launched by SEMI and Global Net Corp. (GNC), examines the emerging market for glass core substrat...
AI is reshaping EDA, but the industry’s trajectory in 2026 will hinge less on model innovation and more on the data, infrastructure, and regulatory realities su...
Cloud service providers (CSPs) worldwide experienced an exponential surge in demand for enterprise SSDs in the first quarter (1Q 2026) due to the need for high-...
Infineon Technologies AG has joined NVIDIA’s MGX AI Factory ecosystem to help transform power delivery for next-generation AI data centers. Infineon’s power man...
Nordic Semiconductor has unveiled a groundbreaking AI-assisted chip-to-cloud solution designed to transform wireless IoT development. The platform is the first ...
Copyright © ElecSuppliers.com. All Rights Reserved.