Entegris Inc. and JSR Corp., the parent company of Inpria Corp., have entered into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet (EUV) lithography for next-generation chip manufacturing.
“As the industry moves to smaller nodes, materials innovation, performance, purity, and reliability become inseparable,” said Olivier Blachier, SVP Chief Strategy & Innovation Officer at Entegris. “This cross-licensing reflects how innovation in semiconductors increasingly happens across the ecosystem, helping customers as they adopt next-generation lithography with greater confidence.”
Under the agreement, Entegris and Inpria will cross-license metal oxide resist (MOR) patents, terminate current Inter Partes Review challenges (IPR2025-00267), and explore collaborative opportunities on future photoresist materials. The work is intended to span resist formulation, precursor synthesis and development, and possibly ultra-clean MOR-specific filtration along with associated delivery systems needed to ensure these new materials perform consistently in high-volume manufacturing for EUV lithography applications.
By combining JSR and Inpria’s collective leadership in metal oxide resist materials with Entegris’ expertise in MOR precursors for CVD deposition, materials handling, and advanced MOR-specific filtration, the collaboration supports the application of advanced materials in semiconductor manufacturing as both parties scale advanced technologies for the AI era.
“Pairing Inpria’s metal oxide resist innovation with Entegris’ purification and materials handling capabilities broadens the applicability of these technologies within the semiconductor materials ecosystem,” said Toru Kimura, Senior Officer at JSR Corp.
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