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C005 iToF 3D Camera Module for High Precision Depth Sensing Applications


As robots, smart devices, and industrial automation systems become more intelligent, accurate environmental perception has become an important requirement for modern electronic products. Traditional cameras can capture images and videos, but they cannot provide accurate distance information, which limits their performance in applications that require three-dimensional understanding.

The C005 iToF 3D Camera Module is a compact depth sensing solution based on iToF (Indirect Time-of-Flight) technology. It enables devices to collect real-time depth information and better understand the position, distance, and shape of objects in the surrounding environment.

With a 640×480 resolution ToF sensor, wide field of view, stable measurement performance, and low computing requirements, the C005 iToF 3D Camera Module is designed for applications such as robotics, machine vision, smart devices, industrial automation, and intelligent control systems.

What Is an iToF 3D Camera Module?

An iToF 3D Camera Module is a depth sensing device that uses light signals to measure the distance between the camera and objects. The module emits modulated infrared light and calculates the phase difference between the emitted and reflected signals to obtain depth information.

Unlike traditional 2D cameras that only provide color and brightness data, an iToF camera can provide three-dimensional information for each pixel. This allows intelligent systems to understand the surrounding environment more accurately.

With depth sensing capability, devices can perform tasks such as:

  • Object distance measurement

  • 3D environment recognition

  • Obstacle detection

  • Object positioning

  • Spatial analysis

This makes iToF technology an important solution for next-generation robotics and intelligent electronic systems.

High Resolution Depth Sensing with 640×480 ToF Sensor

The C005 iToF 3D Camera Module uses a 640×480 resolution ToF sensor to capture detailed depth information in real time.

High-resolution depth data helps improve system performance in applications where accurate spatial information is required, including:

  • Robot navigation

  • Machine vision inspection

  • 3D measurement

  • Smart recognition systems

  • Industrial automation

Compared with conventional vision solutions, the module provides additional depth information, allowing equipment to make more accurate decisions based on the real environment.

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Wide Field of View for Better Environmental Awareness

A wide field of view is important for applications that require large-area detection. By covering a wider viewing range, a 3D camera module can collect more environmental information and reduce the need for multiple sensors.

The C005 provides a wide FOV:

  • Diagonal FOV: 110.3°

  • Horizontal FOV: 89.7°

  • Vertical FOV: 68.3°

This wide-angle design makes the module suitable for mobile robots, intelligent equipment, and automation systems that need better awareness of surrounding objects.

For example, robots can detect nearby obstacles more effectively, while industrial equipment can improve object recognition and positioning accuracy.

5m Measurement Range for Robotics and Smart Applications

The C005 ToF depth camera module supports a measurement range from 0.1m to 5m, covering many indoor and outdoor application scenarios.

In indoor environments, the module can be used for:

  • Robot vacuum cleaners

  • Service robots

  • Smart elevators

  • Smart access control systems

  • Human detection applications

In outdoor and industrial environments, it can support:

  • Delivery robots

  • Lawn mowing robots

  • AGV and AMR systems

  • Industrial automation equipment

The combination of accurate measurement distance and stable depth sensing makes the C005 suitable for various intelligent devices that require real-time environmental perception.

Low CPU Load for Embedded Vision Systems

For embedded products, computing efficiency is an important factor. Processing large amounts of image data can increase system complexity, power consumption, and hardware costs.

The C005 iToF 3D Camera Module is designed to provide efficient depth information output, helping reduce the processing workload of the main controller.

This low CPU load feature makes it suitable for:

  • Edge AI devices

  • Compact robots

  • Embedded vision systems

  • Intelligent terminals

  • Automation controllers

The module supports MIPI CSI-2 high-speed data transmission and IIC control interface, allowing easier integration with embedded platforms.

Stable Performance in Different Operating Environments

Many electronic devices operate in environments with changing lighting conditions and temperatures. Reliable depth sensing performance is essential for these applications.

The C005 iToF 3D Camera Module integrates:

  • Ambient light suppression technology

  • Temperature compensation function

These features help improve measurement stability and maintain reliable performance under different working conditions.

The module supports:

  • Measurement accuracy: ±1%

  • Operating temperature: -20℃ to 65℃

  • Laser safety: Class 1 (IEC60825-1:2014)

This makes it suitable for both indoor and outdoor 3D sensing applications.

Applications of C005 iToF 3D Camera Module

The C005 iToF 3D Camera Module can be used in a wide range of industries where accurate depth information is required.

Robotics and Autonomous Systems

Robots need reliable perception capabilities to navigate safely and efficiently.

The module provides depth information for:

  • Obstacle avoidance

  • Navigation assistance

  • Environmental mapping

  • Autonomous movement

Typical applications include robot vacuum cleaners, service robots, delivery robots, and autonomous mobile robots.

Machine Vision and Industrial Automation

In manufacturing and automation systems, 3D vision technology helps machines understand object position and size.

The C005 can support:

  • Object measurement

  • Package volume calculation

  • Automated sorting

  • Robotic picking

  • Industrial inspection

By adding depth information, machines can achieve higher accuracy and flexibility compared with traditional 2D vision systems.

Smart Devices and Recognition Systems

3D depth sensing is also becoming increasingly important in smart consumer and commercial products.

Applications include:

  • Smart door locks

  • Access control terminals

  • Intelligent gates

  • Interactive devices

Depth information can improve recognition accuracy and enable more advanced user interaction.

Compact Design for Easy Integration

For many embedded applications, product size and integration flexibility are critical factors.

The C005 features a compact structure with dimensions of:

50mm × 21mm × 10.75mm

The module supports:

  • MIPI CSI-2 @1Gbps data interface

  • IIC control interface

  • 1.8V / 3.3V / 3.6V operating voltage

The compact design allows manufacturers to integrate 3D vision capabilities into space-limited products without major hardware changes.

Technical Specifications

Product Name: C005 iToF 3D Camera Module

Technology: iToF (Indirect Time-of-Flight)

Resolution: 640×480

Measurement Range: 0.1m to 5m

Depth Accuracy: ±1%

Field of View: D 110.3°, H 89.7°, V 68.3°

Input Frequency: 24MHz

Modulation Frequency: 75MHz / 90MHz

Data Interface: MIPI CSI-2 @1Gbps

Control Interface: IIC

Operating Temperature: -20℃ to 65℃

Operating Voltage: 1.8V / 3.3V / 3.6V

Laser Safety: Class 1 (IEC60825-1:2014)

A Reliable iToF 3D Camera Module for Future Intelligent Devices

As robotics, artificial intelligence, and automation technologies continue to grow, accurate depth perception is becoming a key requirement for intelligent systems.

The C005 iToF 3D Camera Module combines high-resolution depth sensing, wide-angle detection, compact design, and efficient integration to provide a reliable 3D vision solution.

For companies developing robots, industrial equipment, smart devices, and machine vision systems, the C005 provides an effective way to add advanced depth sensing capabilities and improve product intelligence.

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