Communication Server PCB PCBA Assembly for Network Equipment

Communication servers depend on densely interconnected electronic circuits to handle data processing, networking and communication functions within a relatively compact hardware platform. This communication server PCB and PCBA is designed for server and network equipment where multilayer construction and controlled PCB layout are important to the overall electronic architecture.

The board uses a 6-layer FR-4 construction with a 1.2 mm PCB thickness. Its multilayer structure provides dedicated space for signal routing, power distribution and grounding while allowing a higher concentration of circuitry than a simple single- or double-sided board. This makes the design suitable for communication equipment with multiple electronic functions operating on the same PCB.

The specified PCB fabrication includes a minimum outer trace and space of 0.102 mm/0.1 mm and a minimum drilled hole of 0.1 mm. ENIG surface finish and tented vias are also specified for this board, providing a fabrication configuration suited to dense electronic layouts and SMT component assembly.

Server and communication equipment often require a mixture of compact surface-mounted components and larger packages. The available assembly capability supports component sizes ranging from 01005 devices through larger components, with support for package technologies such as QFP, BGA, POP and flip-chip. This allows the PCBA architecture to accommodate different component densities according to the actual server board design.

Beyond SMT placement, PCB assembly can involve soldering and functional verification appropriate to the project. Available testing methods include ICT, flying probe testing, burn-in, functional testing and temperature cycling, allowing the inspection strategy to be selected according to the board's manufacturing and reliability requirements.

The board can be integrated into communication servers, networking equipment and other data communication hardware where high-density PCB routing and reliable component assembly are required. For system manufacturers, the PCB layout and assembly process can be aligned with the electrical architecture, mechanical dimensions and component requirements of the target equipment.

A multilayer server PCBA is particularly useful when signal routing, power distribution and component density need to be managed within a limited board area. The combination of multilayer fabrication and precision SMT assembly provides a foundation for communication hardware that incorporates processors, memory, networking interfaces and other supporting circuits.

For OEM and custom electronics projects, the PCB structure, component configuration, assembly process and testing requirements can be adapted to the customer's design documentation and production requirements.

Product Features

• 6-layer FR-4 communication server PCB

• 1.2 mm PCB thickness

• ENIG surface finish

• Tented via process

• Minimum outer trace and space of 0.102 mm/0.1 mm

• Minimum drilled hole of 0.1 mm

• Suitable for high-density server electronics

• SMT support for 01005 components

• Supports QFP, BGA, POP and flip-chip packages

• Supports ICT and flying probe testing

• Suitable for communication and network equipment

• Custom PCBA production based on customer designs

Technical Specifications

• Product Type: Communication Server PCB PCBA

• PCB Material: FR-4

• Layer Count: 6 layers

• PCB Thickness: 1.2 mm

• Surface Finish: ENIG

• Via Process: Tented vias

• Min. Trace / Space Outer: 0.102 mm / 0.1 mm

• Min. Drilled Hole: 0.1 mm

• SMT Position Accuracy: 20 μm

• Supported Component Size: 0.4 × 0.2 mm (01005) to 130 × 79 mm

• Supported Packages: Flip-chip, QFP, BGA, POP

• Max. Component Height: 25 mm

• Max. PCB Size: 680 × 500 mm

• PCB Thickness Capability: 0.3–6 mm

• Testing: ICT, Flying Probe, Burn-in, Functional Test, Temperature Cycling