AS0B326-S78N-7F MXM Connector for High-Density Module Connections

ElecSuppliers Part Number GuideAug 26, 2026

AS0B326-S78N-7F is a high-density MXM connector designed for connecting a computing module with a carrier board. With 230 positions and a 0.50mm pitch, this connector is intended for applications where a large number of electrical connections must be accommodated within a limited PCB area.

For engineers searching for the AS0B326-S78N-7F part number, the most important characteristics are not only its contact count. Connector height, mating structure, PCB footprint, mounting method and the mechanical relationship between the module and carrier board all have a direct effect on whether this specific model can be used in a finished design.

AS0B326-S78N-7F at a Glance

The AS0B326-S78N-7F uses a 230-position contact arrangement with a 0.50mm pitch. It is designed for surface-mount PCB assembly and provides a compact interface between a module and the main board.

The S78 configuration is associated with a 7.8mm connector height, making the mechanical profile an important part of the part-number selection.

The connector is designed for applications where board space is limited but the interface still needs to accommodate a large number of power, ground and signal connections.

Why 230 Positions Matter

A module-based electronic system can require connections for much more than basic power and control.

Processor interfaces, memory-related signals, communication interfaces, power rails, ground connections and peripheral functions can all require dedicated contacts.

Using a high-density connector allows these connections to pass between the module and carrier board without requiring a large number of separate connectors.

For AS0B326-S78N-7F, the 230-position configuration is therefore one of its defining characteristics. It allows a relatively compact connector footprint to support a complex module interface.

The 0.50mm Pitch Makes PCB Design Important

A 0.50mm pitch provides high contact density, but it also leaves less physical space around individual pads than a larger-pitch connector.

The PCB footprint should therefore be created from the correct mechanical specifications rather than estimated from the connector's appearance.

Pad dimensions, contact positions, mounting features and nearby component clearance all need to be considered.

For a dense carrier board, even a small footprint error can affect assembly quality or prevent the mating module from aligning correctly.

AS0B326-S78N-7F for Embedded Computing Designs

One of the most relevant uses for an MXM connector is a modular computing architecture.

Instead of designing the processor and all application-specific interfaces onto one large PCB, a system can separate the computing module from the carrier board.

The module handles the core computing functions while the carrier board provides the interfaces required by the particular product.

AS0B326-S78N-7F serves as the physical and electrical connection between these two sections.

This type of architecture can make it easier to develop different carrier boards around a common computing module.

Connector Height Can Affect the Entire Product

The 7.8mm configuration of AS0B326-S78N-7F deserves particular attention during mechanical design.

The connector determines the spacing between the module and the carrier board. That spacing can affect enclosure dimensions, heatsink placement, component clearance and mechanical support.

A connector with the same number of positions but a different height is therefore not automatically a suitable replacement.

When an existing design has been built around AS0B326-S78N-7F, the connector height should be treated as a mechanical requirement rather than an optional specification.

Power and Signal Connections Share the Same Interface

A module connector may carry several different types of electrical connections simultaneously.

Some contacts can be allocated to power and ground, while others are used for digital or control signals.

This makes contact assignment important when designing the carrier board.

Power contacts should be distributed according to the actual current requirements of the module, while sensitive signals should be routed with appropriate attention to their electrical environment.

The connector itself is only one part of the signal path. The PCB traces and reference planes leading to it also influence overall performance.

High-Density Interfaces Need Careful Routing

The 0.50mm pitch of AS0B326-S78N-7F allows many signals to pass through a small physical area.

For slower control signals, routing is generally straightforward.

For faster digital interfaces, however, the transition from module to connector and from connector to PCB traces deserves more attention.

Trace geometry, return paths, routing length and signal spacing can all affect the behavior of high-speed connections.

The carrier-board layout should therefore be developed around the actual interface requirements rather than treating every connector contact as an independent low-speed signal.

Mechanical Alignment Is Critical

A module connector needs accurate alignment between the two mating sides.

If the module is not positioned correctly, the contact interface can be placed under unnecessary mechanical stress.

This is particularly relevant for compact electronics where the connector is surrounded by processors, memory, heatsinks or enclosure structures.

The PCB mounting pattern, module outline and any mechanical fixing points should be reviewed together.

A reliable connection starts with correct mechanical positioning before the electrical characteristics are even considered.

Contact Reliability Matters in Service Applications

The expected service procedure should also influence connector selection.

A module that remains installed throughout the life of the product has different requirements from one that technicians may regularly remove for maintenance.

Repeated insertion and removal creates mechanical wear at the contact interface.

If AS0B326-S78N-7F is used in equipment where modules are regularly exchanged, the expected number of mating cycles should be considered during product qualification.

For fixed installations, the focus may instead be on maintaining stable contact performance throughout long operating periods.

AS0B326-S78N-7F and PCB Assembly

Surface-mount construction makes AS0B326-S78N-7F suitable for PCB-based manufacturing processes.

However, high-density connectors require greater attention during assembly than large-pitch connectors.

The placement process needs to maintain accurate alignment, while soldering quality should be checked across the complete connector footprint.

Inspection is also important because a problem affecting only a small number of contacts can be difficult to identify after the module has been installed.

For production applications, the connector should be included in the PCB assembly validation process rather than evaluated separately from manufacturing.

Temperature and Operating Environment

The operating environment can affect connector reliability over the service life of the product.

Temperature changes can cause mechanical expansion and contraction in the PCB, connector housing and mating module.

Industrial equipment may also experience vibration or other mechanical stress that is uncommon in laboratory prototypes.

For this reason, AS0B326-S78N-7F should be evaluated under the environmental conditions expected in the finished application.

A connector that performs well during initial testing still needs to maintain its electrical and mechanical characteristics throughout the intended product lifetime.

Selecting an Alternative to AS0B326-S78N-7F

Replacing AS0B326-S78N-7F requires more than finding another 230-position connector.

The replacement should be compared for contact count, pitch, mounting method, connector height, mating geometry, PCB footprint and electrical characteristics.

The mechanical interface deserves particular attention.

A replacement with a different vertical profile can change the module position. A different contact arrangement can make the existing PCB unusable. Even a small change to the housing can create interference with nearby components.

For a production design, the replacement should therefore be treated as a new engineering qualification rather than a simple purchasing substitution.

AS0B326-S78N-7F for Compact Modular Electronics

The main value of AS0B326-S78N-7F is its ability to combine a large number of electrical contacts with a compact module interface.

Its 230-position configuration and 0.50mm pitch make it appropriate for high-density board-to-module connections, while the 7.8mm height provides a defined mechanical relationship between the connected boards.

For engineers working on embedded computing equipment, industrial controllers and other modular electronic systems, the complete connector interface should be considered from the beginning of the PCB and mechanical design.

AS0B326-S78N-7F is not simply a 230-pin connector. Its specific pitch, height, mounting structure and mating geometry are what define where this particular part number fits in an electronic system.