XC7A200T-2FBG676I Artix-7 FPGA with 215K Logic Cells


The XC7A200T-2FBG676I is a high-capacity AMD Xilinx Artix-7 FPGA designed for systems that require substantial programmable logic, digital signal processing and high-speed serial connectivity. With 215,360 logic cells, 740 DSP slices, 13.45 Mbit of integrated RAM and 400 user I/O, it provides considerably more processing resources than lower-density Artix-7 devices.

The part uses a -2 speed grade and industrial temperature classification, making it suitable for demanding embedded and industrial hardware where processing capacity and interface flexibility are important.

Large FPGA Capacity for Parallel Processing

The XC7A200T-2FBG676I provides 215,360 logic cells and 16,825 CLB resources. This capacity allows designers to implement complex control logic, parallel processing pipelines, custom interfaces and hardware acceleration functions within a single FPGA.

The Artix-7 architecture is based on a 28 nm process and is designed to provide a balance between programmable performance, power consumption and system cost. For applications that would otherwise require several programmable logic devices, the XC7A200T can provide substantially more logic capacity in one device.

740 DSP Slices for Signal Processing

A major feature of the XC7A200T is its 740 DSP slices. These dedicated arithmetic resources are useful for multiplication, accumulation, filtering and other mathematical operations commonly found in signal-processing systems.

The combination of programmable logic and dedicated DSP resources makes the device suitable for applications such as software-defined radio, imaging, communications, instrumentation and industrial data processing.

Instead of processing every operation sequentially through a conventional processor, designers can create parallel hardware pipelines inside the FPGA and process multiple data streams simultaneously.

13.45 Mbit Integrated RAM

The XC7A200T-2FBG676I includes approximately 13.45 Mbit of total on-chip RAM. The available memory resources can be configured for buffers, FIFOs, lookup tables, packet storage and intermediate processing data.

Keeping frequently accessed data inside the FPGA can reduce communication with external memory and simplify system architecture. For high-throughput designs, internal memory can also be combined with the DSP and logic resources to create dedicated data-processing pipelines.

16 GTP Transceivers for High-Speed Systems

The XC7A200T-2FBG676I includes 16 GTP transceivers, extending the device beyond conventional parallel-I/O FPGA applications. The transceivers can support high-speed serial links for communications, data acquisition, storage interfaces and other bandwidth-intensive systems.

The Artix-7 architecture also includes PCI Express support, providing additional options for connecting the FPGA to processors, computers and other high-performance system components.

With 16 high-speed transceiver channels available, the XC7A200T can be used in designs where multiple serial interfaces need to operate alongside programmable processing logic.

676-FCBGA Package with 400 I/O

The XC7A200T-2FBG676I is supplied in a 676-FCBGA package with an approximately 27 mm × 27 mm package body. The device provides up to 400 user I/O, giving designers considerable flexibility for external memory, peripheral interfaces, control signals and high-speed connections.

The large I/O count is particularly useful in complex boards where the FPGA needs to connect to several external devices at the same time. Designers should also consider PCB routing, power distribution and thermal requirements when working with a device of this capacity.

Industrial Temperature Operation

The XC7A200T-2FBG676I is specified for an industrial temperature range of -40°C to +100°C junction temperature. This allows the device to be considered for industrial equipment and embedded systems exposed to wider temperature variations than typical commercial electronics.

The -2 speed grade provides a higher performance class within the XC7A200T family. When selecting a replacement or alternative, engineers should verify speed grade, package, temperature rating and configuration requirements rather than comparing only the XC7A200T base number.

Applications of XC7A200T-2FBG676I

The processing capacity of the XC7A200T-2FBG676I makes it suitable for applications that demand more FPGA resources than entry-level Artix-7 devices can provide.

Typical applications include industrial vision, high-speed data acquisition, software-defined radio, communications equipment, medical imaging, test and measurement systems, video processing and embedded hardware acceleration.

The large logic capacity also makes the device useful for designs that need multiple functional blocks in one FPGA, such as a processor interface combined with signal processing, high-speed communications and custom control logic.

Designing Around XC7A200T-2FBG676I

The XC7A200T-2FBG676I is positioned toward the higher-capacity end of the Artix-7 family. Its 215,360 logic cells, 740 DSP slices, 13.45 Mbit RAM and 16 GTP transceivers provide enough resources for sophisticated programmable hardware architectures.

The 676-FCBGA package and 400 I/O further support complex system designs, while the industrial temperature rating expands its suitability for demanding embedded environments.

For new FPGA platforms requiring substantial parallel processing, high-speed serial connectivity and a large number of external interfaces, XC7A200T-2FBG676I offers a strong combination of programmable resources and system integration.


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