W25N01KVZEIR NAND Flash Memory Specifications and Applications

ElecSuppliers Part Number GuideSep 26, 2026

W25N01KVZEIR is a 1Gb Serial NAND Flash memory from Winbond. It belongs to the W25N-KV series and is designed for non-volatile data and code storage in embedded electronic systems.

The device supports SPI, Dual SPI, and Quad SPI interfaces and operates from a 2.7 V to 3.6 V supply. It is supplied in an 8-pin WSON package measuring 8 mm × 6 mm and is specified for an operating temperature range of -40°C to +85°C.

W25N01KVZEIR Key Specifications

W25N01KVZEIR provides 1Gb of NAND Flash memory organized as 128M × 8. The device supports a maximum single-transfer-rate frequency of 104 MHz and has a typical access time of 7 ns according to distributor specifications.

The memory uses an internal ECC architecture with 4-bit error correction capability. Its standard page size is 2,048 bytes with an additional 64-byte spare area. The default read mode is Buffer Read.

W25N01KVZEIR Interface

The device supports standard SPI together with Dual SPI and Quad SPI operation. The wider data interface allows the host controller to transfer data using multiple I/O lines, increasing data throughput compared with conventional single-bit SPI operation.

A maximum interface frequency of 104 MHz makes W25N01KVZEIR suitable for embedded systems that require relatively fast access to non-volatile storage without using a larger parallel NAND interface.

W25N01KVZEIR Memory Architecture

W25N01KVZEIR uses Serial NAND Flash technology rather than conventional SPI NOR Flash. The NAND architecture provides a higher-density storage option while maintaining a serial interface that simplifies PCB routing and host-controller connectivity.

The device has 2,048-byte pages and a 64-byte spare area. The internal ECC function helps manage bit errors within the NAND memory array and reduces the amount of error-management work required by the host system.

W25N01KVZEIR Package and Operating Conditions

W25N01KVZEIR uses an 8-pin WSON-8 package with dimensions of approximately 8 mm × 6 mm. The surface-mount package is suitable for compact PCB designs and automated assembly.

The specified supply voltage is 2.7 V to 3.6 V, while the operating temperature range is -40°C to +85°C. These characteristics allow the memory to be integrated into a wide range of industrial and embedded electronic equipment.

W25N01KVZEIR Applications

W25N01KVZEIR can be used for firmware storage, configuration data, operating data, log storage, and other non-volatile memory requirements in embedded systems.

Typical applications include industrial controllers, networking equipment, IoT devices, smart appliances, display systems, embedded computing platforms, and other electronic products that require higher-density serial Flash memory.

The 1Gb capacity provides substantially more storage than many traditional low-density serial memory devices, while the SPI-based interface allows integration with commonly used microcontrollers and processors.

W25N01KVZEIR Design Considerations

When designing with W25N01KVZEIR, engineers should verify the host controller's SPI, Dual SPI, or Quad SPI capabilities and ensure that the selected interface mode is supported by the firmware.

Power supply stability is also important, particularly during program and erase operations. PCB designers should place appropriate bypass capacitors close to the device's power pins and follow the manufacturer's recommended layout practices.

Because NAND Flash has different program, erase, and error-management characteristics from NOR Flash, software developers should also account for the device's NAND architecture and ECC behavior when developing the memory driver.

W25N01KVZEIR Compared With Other W25N01KV Versions

The W25N01KV family includes several package and operating-mode variants. W25N01KVZEIR uses an 8 mm × 6 mm WSON-8 package, while W25N01KVZPIR uses a smaller 6 mm × 5 mm WSON-8 package.

Related versions can also differ in read architecture and spare-area configuration. Therefore, engineers should verify the complete ordering code before treating another W25N01KV device as a replacement.

W25N01KVZEIR Sourcing Considerations

When sourcing W25N01KVZEIR, buyers should specify the complete Winbond part number, package size, storage density, and interface requirements. Similar W25N01KV products can have different package dimensions or read configurations.

For production procurement, buyers should confirm manufacturer availability, package and packing method, production status, traceability, and current lead time. Winbond currently lists W25N01KVZEIR as a mass-production product in its W25N-KV product information.

For replacement applications, the memory density, interface, supply voltage, package footprint, page architecture, ECC characteristics, and software compatibility should all be checked before approving an alternative device.