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SPW17N80C3

SPW17N80C3 Product IntroductionThe SPW17N80C3 is a high-voltage N-channel power MOSFET introduced by Infineon Technologies. Designed based on CoolMOS™ C3 superjunction technology,
TECHNICAL SPECIFICATION
Manufacturer
Category
Transistors
Description
Packaging
Standard Package
MOQ
Negotiable
Datasheet
Datasheet
APPLICATIONS
Consumer Electronics · Embedded Systems · Industrial Control · IoT Devices · Automotive Electronics

Product Details

SPW17N80C3 Product Introduction

The SPW17N80C3 is a high-voltage N-channel power MOSFET introduced by Infineon Technologies. Designed based on CoolMOS™ C3 superjunction technology, it is specifically optimized for high-efficiency switched-mode power supplies and industrial power system applications.

This device features a high breakdown voltage capability of 800V, low on-resistance, and excellent switching performance. It effectively reduces system losses, thereby enhancing overall energy efficiency and power density, making it ideal for high-frequency, high-reliability power supply design scenarios.

Key Features

800V High Breakdown Voltage Design

17A Drain Current Capability

Low On-Resistance for Reduced Power Dissipation

Fast Switching Speed and High Efficiency

Low Gate Charge for Minimal Drive Losses

Excellent dv/dt Robustness

High Reliability and Stability

TO-247 Package with Excellent Thermal Performance

RoHS Compliant

Typical Applications

Switched-Mode Power Supplies (SMPS)

Industrial Power Equipment

LED Drivers

Uninterruptible Power Supplies (UPS)

Photovoltaic Inverters

EV Charging Station Power Modules

Server Power Supplies

Welding Machine Power Systems

High-Voltage DC-DC Converters

Product Advantages Summary


The SPW17N80C3 delivers outstanding efficiency and reliability within high-voltage power systems, making it particularly well-suited for industrial-grade applications with stringent requirements for energy efficiency, stability, and switching performance. Its low-loss characteristics effectively boost overall system performance while simultaneously easing the thermal design burden.


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